JPH0144018B2 - - Google Patents

Info

Publication number
JPH0144018B2
JPH0144018B2 JP58217581A JP21758183A JPH0144018B2 JP H0144018 B2 JPH0144018 B2 JP H0144018B2 JP 58217581 A JP58217581 A JP 58217581A JP 21758183 A JP21758183 A JP 21758183A JP H0144018 B2 JPH0144018 B2 JP H0144018B2
Authority
JP
Japan
Prior art keywords
wafer sheet
wafer
pellet
sheet
annular portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58217581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60110135A (ja
Inventor
Yoshimitsu Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58217581A priority Critical patent/JPS60110135A/ja
Publication of JPS60110135A publication Critical patent/JPS60110135A/ja
Publication of JPH0144018B2 publication Critical patent/JPH0144018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP58217581A 1983-11-18 1983-11-18 ペレットピックアップ装置 Granted JPS60110135A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Publications (2)

Publication Number Publication Date
JPS60110135A JPS60110135A (ja) 1985-06-15
JPH0144018B2 true JPH0144018B2 (en]) 1989-09-25

Family

ID=16706519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58217581A Granted JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Country Status (1)

Country Link
JP (1) JPS60110135A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179751U (en]) * 1985-04-26 1986-11-10
JPS63102237U (en]) * 1986-12-23 1988-07-02
JPH069219B2 (ja) * 1987-12-28 1994-02-02 株式会社新川 ウエハー供給装置
JP4515041B2 (ja) * 2003-04-24 2010-07-28 キヤノンマシナリー株式会社 ウェーハシートのエキスパンド装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504543A (en]) * 1973-05-16 1975-01-17
JPS544062A (en) * 1977-06-13 1979-01-12 Hitachi Ltd Wafer extender
JPS5728949A (en) * 1980-07-30 1982-02-16 Saburo Kano Finishing hot water or shower apparatus annexed to external furnace type bathtub

Also Published As

Publication number Publication date
JPS60110135A (ja) 1985-06-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees